PL-500LT
Low-temperature curing from 180°C
PressurelessLow TempFlexible Electronics
Specifications
ApplicationLow temp
Thermal Cond.>200 W/(m·K)
Resistivity6×10⁻⁶ Ω·cm
Temp.180-230°C
AtmosphereAir
Applications
- •Pressureless
- •Low Temp
- •Flexible Electronics