Elevating Electronics Assembly. Pioneering Semiconductor Packaging.
Joinspire expertise lies in enabling electronics assemblers, PCB fabricators and semiconductor packaging manufacturers globally to elevate the reliability, efficiency and sustainability of products.
Trusted by industry leaders
Thermal conductivity >200 W/(m·K). Shear strength >40 MPa.
Your product, delivered.
Reliability, efficiency, and sustainability included, so you can focus on innovation.
Advanced packaging for chips, GPUs, and 5G infrastructure with superior thermal management.
Automotive-grade materials for EV power modules and harsh environment reliability.
Via filling and component attachment for reliable circuit board assembly.
Precision materials for laser systems, solar cells, and flexible electronics.
ISO 14001 certified, RoHS-compliant, lead-free materials for sustainable manufacturing.
Global Manufacturing
From materials to manufacturing in one partnership.
Joinspire enables electronics assemblers, PCB fabricators and semiconductor packaging manufacturers globally to elevate the reliability, efficiency and sustainability of products.
Explore our products.
Thermal conductivity >200 W/(m·K)
Low porosity for reliability
Wide range of sintering solutions
Custom formulation available on request