Elevating Electronics Assembly. Pioneering Semiconductor Packaging.
Joinspire expertise lies in enabling electronics assemblers, PCB fabricators and semiconductor packaging manufacturers globally to elevate the reliability, efficiency and sustainability of products.
Trusted by industry leaders
Thermal conductivity >200 W/(m·K). Shear strength >40 MPa.
Your product, delivered.
Reliability, efficiency, and sustainability included, so you can focus on innovation.
Advanced nano silver technology with exceptional thermal and electrical conductivity.
Low porosity and high shear strength for demanding semiconductor applications.
Pressure and pressureless sintering for die attach and power modules.
Polymer-based materials for printed electronics and biosensors.
Eco-friendly solutions for modern electronics manufacturing.
Global Manufacturing
From materials to manufacturing in one partnership.
Joinspire enables electronics assemblers, PCB fabricators and semiconductor packaging manufacturers globally to elevate the reliability, efficiency and sustainability of products.
Explore our products.
Thermal conductivity >200 W/(m·K)
Low porosity for reliability
Wide range of sintering solutions
Custom formulation available on request