The Copper Renaissance: Optimizing Data Center Interconnects for the AI Era

As the global demand for AI and high-performance computing (HPC) accelerates, Data Center infrastructure is undergoing a massive transformation. Market projections suggest North American data center infrastructure alone could hit $185 billion by 2040, with a critical focus on power density and efficiency.

However, with great power comes great heat.

The thermal density of next-generation AI accelerators and server power modules is pushing traditional materials to their limits. While Silver (Ag) has long been the gold standard for conductivity, its rising cost and supply volatility are forcing the industry to look for smarter alternatives.

Enter the "Copper Renaissance."

At Joinspire, we believe Copper is not just a cost-down alternative; it is an engineering necessity for the future of sustainable, high-reliability Data Centers. Here is how advanced Copper Paste technologies—specifically Sinter Copper, Solderable Copper, and Via Filling Pastes—are reshaping the interconnect landscape.

1. Pressure-less Sinter Copper: The New Standard for Power Modules

Target Application: Die Attach for IGBT/SiC Power Modules in Server Power Supplies (PSUs)

Data centers run on power. The power conversion modules (utilizing IGBTs or SiC MOSFETs) inside server racks handle immense currents and generate significant heat. Traditional solder alloys often fail under these extreme thermal cycles due to fatigue.

The Joinspire Solution:

Our Pressure-less Sinter Copper Paste offers a revolutionary leap in reliability. Unlike traditional solder, sintered copper forms a pure metal joint with:

Superior Thermal Conductivity: Efficiently transferring heat away from the chip to the heat sink, lowering the junction temperature ($T_j$).

Cost Efficiency: Providing performance comparable to Sinter Silver but at a fraction of the material cost, immune to the volatile silver market.

2. Solderable Conductive Copper: Bridging the Compatibility Gap

Target Application: PCBA, flexible circuit, SMT

In the complex circuitry of server motherboards and peripheral boards, not every connection requires sintering. However, engineers often face a dilemma: Copper pastes typically oxidize and cannot be soldered using standard Surface Mount Technology (SMT) processes.

The Joinspire Solution:

We have cracked the code with our Solderable Conductive Copper Paste. This unique formulation allows engineers to:

Replace Silver Pastes: Swap out expensive Ag pastes used for component terminations (like MLCCs or Inductors) without changing the downstream assembly process.

Direct Solderability: Compatible with standard Sn-based solders (SAC305, SnPb), allowing for seamless integration into existing SMT lines.

Anti-Migration: Unlike silver, copper is far more resistant to electrochemical migration (dendrite growth), significantly enhancing reliability in humid data center environments.

3. Via Filling Copper Paste: The Vertical Thermal Highway

Target Application: High-Density Interconnect (HDI) PCBs & Substrates

As server boards become more compact (more layers, smaller footprint), moving heat and electricity vertically through the PCB is a major bottleneck. Traditional plating methods can be slow and costly for certain high-aspect-ratio vias.

The Joinspire Solution:

Our Via Filling Copper Paste is engineered for high-throughput manufacturing:

Void-Free Filling: Designed with optimized rheology to fill blind and through-holes completely, eliminating air pockets that can cause thermal hotspots.

Thermal Vias: Acts as a direct "thermal highway," conducting heat from hot components on the top layer down to the backside cooling layers.

Coefficient of Thermal Expansion (CTE) Match: Formulated to match the expansion of copper substrates, preventing cracking during the rapid heating and cooling cycles of AI workloads.

Conclusion: Material Strategy is Business Strategy

The data center of 2026 and beyond requires materials that are robust, available, and scalable.

By leveraging Joinspire's advanced copper portfolio—backed by the manufacturing strength of our partner JuFeng—engineers can achieve the "Holy Grail" of interconnects: Silver-like performance with Copper-like economics.

Whether you are designing the next generation of power modules or optimizing high-speed server boards, our team is ready to help you qualify the right material for the job.