PCIM Europe 2026 Recap: Joinspire Showcases Advanced Packaging Materials for SiC
Joinspire presented its silver and copper sintering materials, conductive pastes, and automotive-grade quality systems at PCIM Europe 2026 in Nuremberg.
PCIM Europe 2026 was held in Nuremberg, Germany, from June 9 to 11, bringing together companies across the global power electronics value chain.
Shenzhen Jufeng and its subsidiary, Guangdong Joinspire Technology, presented a portfolio of advanced semiconductor packaging materials designed for SiC and other high-performance power devices. The focus was clear: reliable performance, scalable manufacturing, and practical cost reduction.
Advanced Packaging Materials for SiC and GaN
As SiC and GaN adoption expands across electric vehicles, renewable energy, industrial automation, and AI data centers, packaging materials must handle higher temperatures, greater power density, and longer operating lifetimes.
Joinspire’s portfolio addresses these requirements with materials developed for mass production, process compatibility, and localized supply.
Product Highlights
Silver and Copper Sintering Materials
- Maxilver® Sintering Silver Series: Low-temperature sintering with high-temperature service capability, combined with strong thermal and electrical conductivity. The series is designed for demanding applications such as SiC power devices.
- CuTenix® Sintering Copper Series: A cost-effective alternative offering strong electrical and thermal conductivity, along with resistance to aging and electromigration. It is suited to high-volume packaging applications.
Conductive Pastes for Precision Manufacturing
- CuTenix® Copper Paste for Via-Filling: Developed to improve heat dissipation and electrical conductivity in high-density chip substrates and precision PCBs.
- CuTenix® Solderable Conductive Copper Paste: Combines low-temperature processing with bending stability for heat-sensitive substrates and flexible electronics.
- Maxilver® Conductive Silver Paste Series: Provides stable performance and reliable printability for precision conductive applications.
Quality Systems for Automotive-Grade Production
Joinspire operates standardized and automated production lines with end-to-end control—from raw material preparation and manufacturing to final inspection and product traceability.
Its quality systems include:
- ISO 9001
- IECQ QC080000
- IATF 16949
These certifications support the consistent production and global delivery of automotive- and industrial-grade materials.
Connecting with the Global Power Electronics Industry
At PCIM Europe, the Joinspire team met with customers and industry partners to discuss application requirements, material performance, and future cooperation.
The conversations provided direct insight into overseas market needs and will help guide the company’s next stage of product development and international expansion.
Ready to innovate with us?
Contact our team to learn how our advanced materials can transform your manufacturing.