PCIM Asia 2026 Shenzhen Power Electronics Show: Event Recap

PCIM Asia 2026 Shenzhen concluded successfully at the Shenzhen World Exhibition & Convention Center, running from August 26 to 28.

Guangdong Joinspire Technology brought its full team to the show, presenting its complete lineup of advanced packaging and interconnection materials at Booth B42, Hall 16, and engaging in extensive discussions with industry partners throughout the event.

Strong turnout: the Joinspire booth draws the crowd

Traffic at the Joinspire booth stayed high across all three days. Engineers, R&D staff, procurement managers, and industry peers from China and abroad stopped by for in-depth technical discussions on Joinspire's advanced material solutions and to explore supply opportunities. Both technical exchanges and business discussions ran at a steady pace throughout the show.

Featured product: large-area silver sintering draws strong interest

Among the products on display, the large-area copper sintering series generated the most inquiries. Targeting the large-area sintering requirements of SiC power module manufacturers, Joinspire introduced FC-200U-LA, a pressure-assisted sintering copper paste built for high reliability and stability. With its "low-temperature sintering, high-temperature service" profile, the product delivers strong thermal and electrical conductivity, drawing steady interest from professional visitors and becoming the clear highlight of the Joinspire booth.

The booth also featured several other core in-house materials, including the pressure-assisted and pressureless sintering silver paste series and solderable conductive copper paste, both of which attracted considerable attention from visitors.

Many visitors held in-depth discussions with the team on process parameters and custom development options. Several expressed interest in working together on the spot, and both sides are now following up on sample testing and volume supply arrangements.

Professional service builds trust The strong turnout at the booth reflected the professionalism, efficiency, and sincerity of the Joinspire team. Facing a steady stream of visitors, the technical team responded with consistent energy and depth of expertise, walking each visitor through product characteristics and answering technical questions in detail.

Beyond the technology: a lighter side to the booth Alongside the technical displays, a robot performance at the Joinspire booth drew a large crowd of onlookers, and giveaways added to the interactive atmosphere. Visitors left with both a look at cutting-edge technology and a token of appreciation from Joinspire.

The successful close of PCIM Asia Shenzhen 2026 marks another strong showing for Joinspire in the power semiconductor sector. Thank you to everyone who visited Booth B42 in Hall 16, old friends and new.

Going forward, Joinspire will continue to advance its core technology in third-generation semiconductor packaging materials, delivering better products and stronger service to earn the continued trust of its customers. We look forward to seeing you again at the next show.

See you again in October: Show name: China International Electronic Circuits (Greater Bay Area) Exhibition Dates: October 27–29 Joinspire booth: 6C23 Venue: Shenzhen World Exhibition & Convention Center, China