Demand for this SiC Material to Surge by 700%: How Joinspire is Seizing the First-Mover Advantage

With the rapid development of high-power electronics industries, such as new energy vehicles (NEVs) and 5G communications, the demands placed on electronic packaging technologies are constantly increasing—particularly concerning high-power handling, high-temperature endurance, and long-term stability. Traditional gold-tin (AuSn) solders have long been used in optoelectronic packaging and high-reliability military electronic devices due to their excellent baseline characteristics. However, as performance requirements continue to escalate, AuSn solders are encountering significant limitations:

• High Brittleness: Highly susceptible to cracking under operational stress.
• Complex Fabrication: Intricate manufacturing processes that are difficult to scale for mass production.
• High Costs: The premium price of gold-tin alloys significantly inflates overall production expenses.

Sintered silver, as a next-generation die-attach material, offers bonding reliability up to 10 times higher than that of traditional solder alloys. Consequently, the industry is experiencing a definitive shift away from traditional solder alloys and toward sintered silver. According to projections by Mitsui Kinzoku, the market for sintering materials is expected to reach approximately 80 billion yen (around 3.65 billion RMB) by 2035—roughly a 700% increase over its current size.

Joinspire stands out as a leading domestic manufacturer that has successfully localized the production of sintered silver pastes. Leveraging unique technical expertise in this field, Joinspire delivers products with outstanding processing performance. Industry publication “Insider Talks - Third Generation Semiconductors” recently highlighted five core advantages that allow Joinspire’s sintered silver products to perfectly balance high performance with exceptional cost-effectiveness:

Five Key Advantages: Joinspire Sintered Silver Demonstrates Superior Performance

The sintered silver launched by Joinspire outperforms traditional AuSn solder across multiple critical metrics:

1. Superior Shear Strength

• Joinspire pressureless sintered silver: 30–50 MPa
• Joinspire pressure-assisted sintered silver: 65–90 MPa
• Traditional AuSn solder: 30–60 MPa
• Joinspire sintered silver: 230°C – 260°C
• Traditional AuSn solder: >300°C
• Advantage: This lower processing threshold ensures compatibility with a wider array of temperature-sensitive components and processes, significantly broadening its application scope.

3. Exceptional High-Temperature Endurance

• Joinspire sintered silver: Melting point up to 961°C
• Traditional AuSn solder: Maximum service temperature of 280°C
• Advantage: Once sintered, Joinspire's silver performs flawlessly in extreme high-temperature environments far beyond the capabilities of traditional solders.

4. Enhanced Thermal Conductivity

• Joinspire sintered silver: >200 W/m·K
• Traditional AuSn solder: ~60 W/m·K
• Advantage: This massive leap in thermal conductivity guarantees highly efficient heat dissipation, drastically improving the overall reliability and lifespan of high-power electronic devices.

5. Broader Material Compatibility

• Joinspire's sintered silver reliably bonds with a wide variety of interfaces, including gold, silver, copper, nickel, stainless steel, aluminum alloys, and glass.
• Advantage: Traditional AuSn solder is highly sensitive to composition changes near its eutectic point; when gold diffusion from plated layers pushes the gold weight percentage above 80%, its melting point rises sharply. Joinspire's sintered silver completely avoids these diffusion-related complications.

Future Outlook: Joinspire Sintered Silver Will Bring More Surprises and Possibilities

In conclusion, sintered silver pastes present vast application prospects across the electronics industry. As technology continues to evolve and innovate, sintered silver is poised to rapidly replace traditional AuSn solders, playing a pivotal role in driving the advancement of power electronics. We anticipate further breakthroughs as sintered silver enters new fields, ultimately enabling more reliable and efficient electronic products for a smarter world.

The successful launch of Joinspire sintered silver marks a major milestone in electronic packaging materials. Let us look forward to the continued innovations and limitless possibilities that Joinspire will bring to the global electronics industry.